Tokyo Electron Limited (OTCMKTS:TOELY) Sees Significant Decline in Short Interest

Tokyo Electron Limited (OTCMKTS:TOELYGet Free Report) saw a significant decline in short interest during the month of October. As of October 15th, there was short interest totalling 49,100 shares, a decline of 82.9% from the September 30th total of 286,500 shares. Based on an average daily volume of 250,700 shares, the days-to-cover ratio is currently 0.2 days.

Wall Street Analyst Weigh In

Separately, Sanford C. Bernstein upgraded Tokyo Electron to a “strong-buy” rating in a research report on Monday, October 7th.

View Our Latest Research Report on Tokyo Electron

Tokyo Electron Stock Up 0.7 %

TOELY traded up $0.54 during midday trading on Friday, hitting $77.25. The company had a trading volume of 141,036 shares, compared to its average volume of 175,051. The company has a market capitalization of $143.07 billion, a price-to-earnings ratio of 28.82 and a beta of 1.50. The stock’s 50 day moving average price is $85.02 and its 200 day moving average price is $100.32. Tokyo Electron has a 52 week low of $64.30 and a 52 week high of $134.91.

Tokyo Electron (OTCMKTS:TOELYGet Free Report) last announced its quarterly earnings results on Thursday, August 8th. The company reported $0.87 earnings per share (EPS) for the quarter. The business had revenue of $3.56 billion for the quarter, compared to analyst estimates of $3.12 billion. Tokyo Electron had a return on equity of 24.79% and a net margin of 21.32%. Research analysts predict that Tokyo Electron will post 3.23 EPS for the current year.

About Tokyo Electron

(Get Free Report)

Tokyo Electron Limited, together with its subsidiaries, develops, manufactures, and sells semiconductor and flat panel display (FPD) production equipment in Japan, Europe, North America, Taiwan, China, South Korea, Southeast Asia, and internationally. The company offers coaters/developers, etch systems, surface preparation systems, deposition systems, test systems, wafer bonders/debonders, wafer edge trimming, SiC epitaxial CVD systems, gas cluster ion beam system, and cleaning systems.

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